NEPCON West - Fiberoptic Expo Conference Proceedings


PROCESS CHARACTERIZATION OF PCB ASSEMBLY USING 0201 PACKAGES WITH LEAD-FREE SOLDER

Author: David Geiger et al.
Company: Flextronics
Date Published: 12/3/2002   Conference: NEPCON West - Fiberoptic Expo


Abstract: 0201 assembly plays a very important role in the miniaturization of electronics products. After a systematic study with Sn-Pb solder paste on pad design, machine evaluation, component qualification, and process optimization, this study has been focused on PCB assembly process for 0201 packages using Sn-Ag-Cu solder paste. The post-reflow solder defects for the different spacings were examined for the different solder pastes.

Key words: 0201, lead-free.



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