AGILE CURING FOR PHOTONICS ASSEMBLYAuthors: Richard S. Garard and Joseph Wander
Company: Lambda Technologies, Inc.
Date Published: 12/3/2002 Conference: NEPCON West - Fiberoptic Expo
Tack cure of high performance adhesives is one of the methods used for such in-situ bonding. Adhesive bonding continues to be attractive given the continued rapid evolution of part structures and materials. However, concerns over machine throughput and thermal distortion often lead to compromises for adhesive selection and cure.
In-situ cure is generally limited to a tack cure (partial cure) in order to guard throughput of the active alignment workcell. As described herein, microwave energy can be used to couple heat energy directly to the adhesive material and package interior. Specifically, Variable Frequency Microwave (VFM) can offer the speed and control of cure required to enable a cost effective, full in-situ cure. This paper presents information about this novel curing technology.
Key words: fiber optic assembly, active alignment, in-situ cure, adhesive cure, microwave, yield enhancement.
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