NEPCON West - Fiberoptic Expo Conference Proceedings


AGILE CURING FOR PHOTONICS ASSEMBLY

Authors: Richard S. Garard and Joseph Wander
Company: Lambda Technologies, Inc.
Date Published: 12/3/2002   Conference: NEPCON West - Fiberoptic Expo


Abstract: Assembly of high performance photonic components continues to push the state if of the art for precision assembly. "Active Alignment" - a technique where measurements of part function are used to guide actuator position - is often required to achieve acceptable component alignment. These active alignment systems require rapid and reliable bonding of the part components as they are held in position.

Tack cure of high performance adhesives is one of the methods used for such in-situ bonding. Adhesive bonding continues to be attractive given the continued rapid evolution of part structures and materials. However, concerns over machine throughput and thermal distortion often lead to compromises for adhesive selection and cure.

In-situ cure is generally limited to a tack cure (partial cure) in order to guard throughput of the active alignment workcell. As described herein, microwave energy can be used to couple heat energy directly to the adhesive material and package interior. Specifically, Variable Frequency Microwave (VFM) can offer the speed and control of cure required to enable a cost effective, full in-situ cure. This paper presents information about this novel curing technology.

Key words: fiber optic assembly, active alignment, in-situ cure, adhesive cure, microwave, yield enhancement.



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