Pan Pacific Symposium Conference Proceedings


ULTRA-THIN PRINTED CIRCUIT ASSEMBLY – A SOLUTION FOR LIGHT WEIGHT & COMPACT ELECTRONIC PRODUCTS

Author: Dale Lee
Company: Iomega Corporation
Date Published: 2/2/1999   Conference: Pan Pacific Symposium


Abstract: Just a few years ago, printed circuit assemblies (PCA) were rigid and relatively thick with little or attention paid to component heights on the printed circuit assembly. However, today’s consumers are demanding and receiving smaller, more powerful, user friendly, portable electronic products which require smaller and thinner PCB’s/PCA’s. This shrinkage has impacted not only the size of the products but thickness and manufacturing tolerance as well. These changes are placing new demands on product Design, Development, DFM, Manufacturing/Process and Test Engineers to ensure that the product can be assembled and tested.

This paper will address many of the problems associated with the development, manufacturing and test of ultra-thin printed circuit assemblies.



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