NEPCON West - Fiberoptic Expo Conference Proceedings


Author: Dirk D. Brown et al.
Company: HCD, Inc.
Date Published: 12/3/2002   Conference: NEPCON West - Fiberoptic Expo

Abstract: Two new land grid array (LGA) connection technologies are presented that resolve many of the limitations of current LGA connector approaches. In the first approach, a dual-metal spring is used to decouple the electrical and mechanical properties of the LGA. This provides a contact element that can be engineered to meet specific mechanical and electrical requirements and can be used in high durability and high temperature applications. In the second approach, a novel design is used to produce Cu-alloy springs supported in a fully cross-linked polymer ‘button’.

This button acts as a reliable, high-frequency, low-profile connector element capable of handling high current densities. In addition, the mechanical and electrical properties of the button can be easily modified to meet specific application requirements. A unique carrier approach is used with these technologies to make LGA connectors with very high pin counts, small pitch, and flexible footprints. Electrical and reliability data is presented for several of these connectors.

Key words: LGA, land grid array, socket, electrical contact.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819