VIA-FILLING USING ELECTROPLATING FOR BUILD-UP PRINTED CIRCUIT BOARDSAuthor: I. Kobayashi
Company: Kanto Gakuin U.
Date Published: 2/2/1999 Conference: Pan Pacific Symposium
In previous reports, we examined the filling of micro-vias by the electroless copper plating and electroplating with the applied periodic reverse current, In this report, we investigated the filling of micro-vias by the electroplating with direct current and pulsed current, with a variety of additives and controlled current wave forms.As a result, the selection of proper additives was effective to fill rnicro-vias with copper even under the condition of electroplating applied direct current. In the case of electroplating applied pulsed current, the filling of micro- vias could be achieved more easily. Moreover, the concentration of copper sulfate in the electroplating bath was highly correlated to the filling property and higher copper concentration showed the good performance for via- filling. Key words : Build-up Process , Via-hole , Filling ,Electroplating
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