SMTA International Conference Proceedings


Authors: Andy Yates et al.
Company: Cyberoptics Corporation
Date Published: 9/22/2002   Conference: SMTA International

Abstract: Deploying inspection technologies within a manufacturing process that utilizes miniature passive devices such as 0201s is essential. Specifically, inspection of solder paste and component placement can greatly reduce systematic and random defects and inspection of soldered components can be a manageable alternative to increasingly difficult ICT coverage.

Monitoring and acting upon the information that inspection systems produce can not only eliminate defects but also warn of potential future defects. Vital to the analysis of SPC data is a scalable database and appropriate tools.

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