ASSEMBLY PROCESS QUALIFICATION ON 0201 PACKAGES FOR VOLUME MANUFACTURINGAuthor: Mei Wang et al.
Company: Flextronics International
Date Published: 9/22/2002 Conference: SMTA International
No-clean solder pastes from several different vendors, and different types of 0201 components, were used. Detailed studies were carried out on important process parameters, including solder paste printing, component pick-and-place, and reflow. The post-reflow solder defects for different spacings were examined for the different solder pastes and component types.
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