COST SAVINGS AND BENEFITS OF REWORKING BGA, CSP AND PWB MODIFICATIONS FOR HIGH PERFORMANCE APPLICATIONS
Author: Stephen R. Stegura et al. Company: Raytheon Electronic Systems Date Published: 9/22/2002
Abstract: The continued need for higher density designs with advanced electronic packaging technologies such as Ball Grid Array (BGA) and Chip Scale Packaging (CSP) and other commercial component technologies are important to Raytheon. Due to the costs associated with the development of certain high performance products, there is a critical need within Raytheon to develop rework capability of assemblies using these technologies. Unlike the commercial arena which produces high volume - low cost products such as cell-phones, personal digital assistants (PDA), computers and digital cameras, to name a few, the products developed by Raytheon Electronic Systems are considered low volume - high cost. The economics of the commercial arena indicate that reworking an electronic assembly is more the exception than the rule, whereas rework is a critical requirement for Raytheon. This paper will cover BGA/CSP rework, the process of repairing/modifying Printed Wiring Boards (PWB) when using these packages and the benefits associated with having this capability. In addition, we will highlight some of the lessons learned through our in-house process development. These capabilities stem from the leveraging of packaging technology development of the JPL/NASA led consortium, which Raytheon has been a member for the past seven years. Key Words: BGA, ASIC, CSP, PWB, X-ray, reflow, Kapton, rework, thermal profile.