RELIABILITY AND PASTE PROCESS OPTIMIZATION OF EUTECTIC AND LEAD-FREE FOR MIXED PACKAGINGAuthor: Prof. S. Manian Ramkumar et al.
Company: Rochester Institute of Tech.
Date Published: 9/22/2002 Conference: SMTA International
The goal of this study is to characterize the effects of numerous paste print parameters using experimental design techniques. It is aimed to understand the impact of various print process parameters, BGA and CSP pitch density and area aspect ratio (AAR) on the solder paste print quality and volume, for both eutectic and lead-free pastes.
This paper reports the results of an experiment that utilized the JPL’s (Jet Propulsion Laboratory’s) area array consortium test vehicle design, containing a myriad of mixed technology BGAs and CSPs (ball grid array and chip scale packages) with an OSP finish. No-Clean and No-Lead solder pastes (Type III and IV), with viscosity ranging from 900-1200 Kcps were used in this study.
Reliability of the test vehicles with lead-free and eutectic pastes was evaluated by subjecting the PWB with paste to specified number of reflow cycles representative of lead-free and eutectic assembly. The reliability evaluation is aimed at determining solder joint quality and Microvia integrity, when subjected to multiple reflow heating cycles. The details of the reliability study are also presented in this paper.
Key words: DOE, BGA, CSP, eutectic, lead-free, reliability, AAR, SMT.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.