A STUDY OF LEAD-CONTAMINATION IN LEAD-FREE ELECTRONICS ASSEMBLY AND ITS IMPACT ON RELIABILITYAuthors: Karl Seelig and David Suraski
Company: AIM, Inc.
Date Published: 9/22/2002 Conference: SMTA International
In short, the issue of which alloy(s) to select continues to loom. This paper shall take an in-depth view of Sn/Ag, Sn/Ag/Cu and Sn/Cu alloys and compare the reliability testing results and process considerations for these. First, however, this paper will address the often-misunderstood issue of lead contamination of lead-free free assemblies.
As will be discussed, the contamination of lead-free solder joints from lead on components or PWBs can reduce reliability and result in solder joint failure.
Key words: lead-free, solder, contamination, reliability.
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