QUALIFICATION OF 3-D SOLDER PASTE INSPECTION SYSTEMS FOR EFFECTIVE IN-LINE PROCESS CONTROLAuthor: Sharafali Shaherwala et al.
Company: State University of New York
Date Published: 9/22/2002 Conference: SMTA International
Process control entails understanding the manufacturing process and its variation along with the variation of the measurement systems employed. Automated solder paste inspection with 100% board and component coverage is relatively new to the Surface Mount Technology (SMT) industry.
This paper addresses the approach to quantify variation in the measurement system. A scientific and systematic methodology to analyze a 3-D automated solder paste inspection system based on Measurement System Analysis (MSA) studies is delineated.
As part of the MSA study, standard approaches have been developed for conducting accuracy analyses, linearity studies, and Gage Repeatability and Reproducibility (GR&R) analyses for automated solder paste inspection equipment. The approach suggested is validated by case studies on two sets of automated solder paste inspection equipment. Results of the case study are discussed.
Key words: automated solder paste inspection, process control, measurement system analysis.
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