SMTA International Conference Proceedings


Author: Sharafali Shaherwala et al.
Company: State University of New York
Date Published: 9/22/2002   Conference: SMTA International

Abstract: The assembly of Printed Circuit Boards (PCBs) consists of several processes and sub-processes. Literature and experience suggests that solder paste deposition during stencil printing is the primary cause of defects [3]. Therefore, an organization must encompass robust processes such that the occurrence of defects is prevented.

Process control entails understanding the manufacturing process and its variation along with the variation of the measurement systems employed. Automated solder paste inspection with 100% board and component coverage is relatively new to the Surface Mount Technology (SMT) industry.

This paper addresses the approach to quantify variation in the measurement system. A scientific and systematic methodology to analyze a 3-D automated solder paste inspection system based on Measurement System Analysis (MSA) studies is delineated.

As part of the MSA study, standard approaches have been developed for conducting accuracy analyses, linearity studies, and Gage Repeatability and Reproducibility (GR&R) analyses for automated solder paste inspection equipment. The approach suggested is validated by case studies on two sets of automated solder paste inspection equipment. Results of the case study are discussed.

Key words: automated solder paste inspection, process control, measurement system analysis.

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