SMTA International Conference Proceedings


Author: Zsolt Nemes
Company: Solectron
Date Published: 9/22/2002   Conference: SMTA International

Abstract: With the increased number of highly integrated, doublesided reflow boards and the increased use of press-fit connectors, the need for the conventional wave soldering process has considerably declined. Today, more than 70% of prototypes are double-sided reflow boards with only few THT components as interfaces to be soldered. Consequently, the question arises as to which soldering method may be beneficial in aspects regarding quality, efficiency and cost-effectiveness: Manual or automated selective wave soldering?

This presentation highlights the principles of selective wave soldering, the different alternatives used for fluxing, preheating, soldering and board handling. Also, different programming possibilities and their expenditure will be discussed. It will be demonstrated that quality aspects such as hole filling, flux residue, thermal stress on components as well as failure rates are clearly in favour of the automated wave soldering method. A capital investment to change from manual soldering to automated soldering must also be studied from an economical point of view. It will be shown quantitatively under which circumstances a selective wave soldering machine becomes economically favourable.

Key words: selective soldering, pin in paste, solder joints, mini wave.

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