Pan Pacific Symposium Conference Proceedings


THE NEW POSSIBILITIES FOR MANUFACTURABILITY OF THICK – FILM INTELLIGENT GLUCOSE BIOSENSORS IN MCM-C TECHNOLOGIES

Author: J. J. Gondek
Company: Jagiellonian University
Date Published: 2/2/1999   Conference: Pan Pacific Symposium


Abstract: The penetration of microelectronics into new markets is seriously hampered by the lack of efficient, low-cost sensors. It is not surprising therefore to find that these devices are subject of research in many laboratories. The microelectronic technologies open for biosensors wide application possibilities, especially hybrid multilayer structures (MCM-C). The construction of intelligent sensors requires to apply the specialised integrated circuits (ASICs) in chip form, exceptionally suitable for assembly in thick-film MCM-Cs.

Future hybrid microcircuits devices and systems will require the cofired ceramic MCM technologies for the higher performance, smaller volume, faster speed, lower weight and higher density, that cannot be provided by traditional hybrid microcircuits and printed wiring board technologies.

The present paper is devoted to the technological problems connected with the construction, the choice of pastes and substrates, the screening process and the laser trimming involved in the production of thick-film intelligent glucose biosensors (TF-ASIC-BIO) designed by the authors. It also gives their main functional parameters and characteristics indicating the possibility of the use of thick-film sensors not only in the detection of glucose but also in multi-enzyme sensor construction in the medical systems.

Key words: multichip module ceramic (MCM-C), LTCC substrate, glucose biosensors, multienzyme sensors.



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