SMTA International Conference Proceedings


Author: Mathias Nowottnick
Company: Fraunhofer IZM
Date Published: 9/22/2002   Conference: SMTA International

Abstract: This paper presents the results of a development of a condensation soldering technology and machine, which is particularly suitable for lead-free soldering. Because vapor phase or condensation soldering is a high effective heating method with a sharp maximum peak and very small differences in temperature, it is possible to carry out reflow soldering for high melting lead-free solders with a good wetting quality and low thermal stress in substrate and components.

For the industrial use it is very important to realize this condensation soldering as an inline process, without changing of transport direction and in an open system. For a fast solution of this task a very effective project team with partners from industry, applied research and science was made up. A laboratory version of this new machine was constructed and tested. So it was possible to realize first trials with actually printed circuit boards from production.

Key words: lead-free, condensation soldering, vapor phase.

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