SMTA International Conference Proceedings


OVERCOMING THE CURRENT QUALITY PLATEAU

Author: Michael Motherway
Company: Motorola Mfg. Software SBU
Date Published: 9/22/2002   Conference: SMTA International


Abstract: Quality is a business requirement for most firms in the electronics assembly industry, and process improvement is a competitive weapon for reducing costs and satisfying customers. Current process improvement and problem solving techniques can often be characterized as tactical, fad-driven, ad hoc, mistake/fix oriented, and high cost. This paper discusses tools, techniques, and a case study demonstrating how Motorola overcame these characteristics and pushed past the 5 Sigma plateau.

Six Sigma Black Belts defined requirements for a software tool to monitor SMT equipment for quality improvement opportunities. This application has a Statistical Process Control (SPC) module in which standard Western Electric rules are used according to the Shewhart method (classical rules for SPC charting published in the 1930’s) to detect and respond to out-of-control events. Standard SPC measurements are offered, in addition to user configurable parameters to measure the shop floor for experimental use.

Once accomplished, this historical data is easily parsed and analyzed with more sophisticated analysis tools. The process of knitting together these tools for greater value, typically done with e-bonding software supplied by Oracle, Microsoft and others, is also discussed in some detail.



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