SMTA International Conference Proceedings


SYSTEM IN PACKAGE PROCESS SOLUTIONS BASED ON FLIP CHIP PROCESSING

Author: Brian J. Lewis et al.
Company: Siemens Dematic EAS
Date Published: 9/22/2002   Conference: SMTA International


Abstract: Dramatic changes are underway in the computer, telecommunication, automotive, and consumer electronics industries. Changes that demand common and pervasive requirements for active assemblies are (1) ultra-low cost, (2) thin, light, and portable, (3) high performance, and (4) diverse functionality.

The biggest bottleneck to achieving these requirements are typically not the ICs but rather the electronic packaging. System in Packaging (SIP) is a packaging solution that provides the high performance and high flexibility package architectures that meets the system demands.

System in packaging provides a unique packaging solution allowing designers to tailor high density and high performance electronic systems into application specific packages at costs far less than custom, system on chip solutions. Depending on their application environment, SIPs provide for high levels of integration between interconnect levels, passive elements, optoelectronic, digital, and RF functions.

To achieve this, the predominant chip to package interconnect strategies are die attach with wire bonds and flip chip interconnects on multi-functional high density interconnect substrates. The need for high I/O counts, high performance, and high speed has moved to the forefront in customer requirements. Flip chips provide increased I/O counts, improved electrical performance, reduced cost, and smaller size as compared to die attach, wire bond chips.

This paper presents a review of flip chip interconnect technology with particular emphasis on design for manufacturing for system in packages to insure high yield production. Factors such as substrate design guidelines, bump design guidelines, under bump metallization selection, interconnect materials selection, and underfill selection are discussed. In addition, reliability requirements and test methods are also reviewed. A case study on flip chip blue tooth module processing is presented.



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