SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTEAuthor: Fay Hua et al.
Company: Intel Corporation
Date Published: 9/22/2002 Conference: SMTA International
This paper presents the results of solder joint reliability evaluation of VFBGA (very fine pitch ball grid array) and SCSP (stacked chip scale package) Pb-free packages attached to Printed Circuit Boards (PCBs) with eutectic Pb-Sn pastes. The packages were assembled under various reflow profiles using standard Pb-Sn assembly conditions. Peak reflow temperatures of 208°C and 222°C with a soak profile or a direct ramp up profile was used.
The assemblies were subjected them to board level temperature cycling (-40 °C to 125°C, 30 minutes per cycle) and drop testing. Detailed failure analysis will also be presented.
Key words: solder joints, reliability, BGAs, Pb-free, Pb-Sn and Sn-Ag-Cu solder compatibility.
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