SMTA International Conference Proceedings


GETTING FACTORY READY FOR 0201 ASSEMBLY

Authors: Tony Huang and Rudolph Yu
Company: Adaptec, Inc.
Date Published: 9/22/2002   Conference: SMTA International


Abstract: As design engineering has increased the interest in using smaller electronic packages on the board design, the 0201 chip has become a challenging component to PCB (Printed Circuit Board) assemblers. The areas such as board design, assembly process, inspection method, rework process, and solder joint reliability need to be revisited before 0201 chips are implemented onto the board design.

The paper presents the results and recommendation from an evaluation of a 0201 implementation project. A 0201 test vehicle was designed to study the Design For Manufacturability (DFM) rules, key assembly factors, inspection methods, rework processes and solder joint reliability.

This paper demonstrates the methods used on each phase of evaluation. Design of Experiment (DOE) was used on screen print process to study the critical parameters of stencil design and printing process setup. A methodology was developed to evaluate the placement process window against footprint design.

A bigger process is desired and can be achieved through footprint optimization. In-depth comparison and study among AOI (Automated Optical Inspection), X-ray and video microscope inspection were reviewed. The benchmark of the various inspection options against investment cost, manpower requirement and screening effectiveness was carried out to decide on the inspection selection.

In addition, the rework tool and methods were evaluated. Finally, shock and vibration and thermal cycling were performed to exam the solder joint reliability.

Key words: 0201, DFM, AOI, DOE.



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