SMTA International Conference Proceedings


Authors: Tim Jensen and Ronald C. Lasky, Ph.D., PE
Company: Indium Corporation of America
Date Published: 9/22/2002   Conference: SMTA International

Abstract: The increased complexity and lower margins of many printed circuit assemblies (PCAs) has resulted in designs that are often difficult or cost prohibitive to wave solder. For these reasons, alternative assembly methods are viewed with great interest.

The "Pin in Paste" (PIP) process can often be used in place of wave soldering. In light of this opportunity, this paper discusses practical tips in implementing PIP. Stencil design, solder paste, stencil printing, component issues and the reflow process will be discussed. We will also present a software tool that facilitates the design of PIP stencils.

Key words: pin in paste, stencil printing, intrusive reflow, wave soldering.

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