PRACTICAL TIPS IN IMPLEMENTING THE "PIN IN PASTE" PROCESSAuthors: Tim Jensen and Ronald C. Lasky, Ph.D., PE
Company: Indium Corporation of America
Date Published: 9/22/2002 Conference: SMTA International
The "Pin in Paste" (PIP) process can often be used in place of wave soldering. In light of this opportunity, this paper discusses practical tips in implementing PIP. Stencil design, solder paste, stencil printing, component issues and the reflow process will be discussed. We will also present a software tool that facilitates the design of PIP stencils.
Key words: pin in paste, stencil printing, intrusive reflow, wave soldering.
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