SYSTEM-IN-PACKAGE: THE NEXT GENERATION IN IC PACKAGINGAuthor: Frank Juskey
Company: Advanced Interconnect Tech.
Date Published: 9/22/2002 Conference: SMTA International
The major difference between the MCM’s of yesterday and the system-in-package of today is the use of smaller, improved yielding die at the wafer level, fewer memory die needing burn-in, and the integration of extremely reliable, low cost surface mounted components. This new packaging technology is also easy-to-use from a design standpoint and brings many features and benefits.
Some of these benefits to second-level assemblers or original equipment manufacturers (OEMs) include reduced manufacturing costs and fewer defects during production. This paper will address the design considerations and manufacturing technologies that have led to the development of SIP, as well as the technology requirements imposed by the OEMs to help define the SIP as a lower cost alternative to discrete component placements.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.