SMTA International Conference Proceedings


SYSTEM-IN-PACKAGE: THE NEXT GENERATION IN IC PACKAGING

Author: Frank Juskey
Company: Advanced Interconnect Tech.
Date Published: 9/22/2002   Conference: SMTA International


Abstract: The latest innovation in integrated circuit (IC) packaging to emerge in the electronics marketplace is System-In-Package (SIP). SIP is emerging within the traditional chip and wire subcon IC packaging industry where SMT is mated with an IC underneath a mold cap. While multi-chip modules (MCM’s) have enjoyed only very limited use due to prohibitively expensive substrate technologies, know good die issues, and poor yields, the explosive growth of surface mounted discrete component placement has driven manufacturing costs in the complete opposite direction.

The major difference between the MCM’s of yesterday and the system-in-package of today is the use of smaller, improved yielding die at the wafer level, fewer memory die needing burn-in, and the integration of extremely reliable, low cost surface mounted components. This new packaging technology is also easy-to-use from a design standpoint and brings many features and benefits.

Some of these benefits to second-level assemblers or original equipment manufacturers (OEMs) include reduced manufacturing costs and fewer defects during production. This paper will address the design considerations and manufacturing technologies that have led to the development of SIP, as well as the technology requirements imposed by the OEMs to help define the SIP as a lower cost alternative to discrete component placements.



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