SMTA International Conference Proceedings


MONITORING MOTHERBOARD SHOCK STRAIN RESPONSE NEAR BGA SOLDER JOINTS

Authors: Phil Geng and Willem M Beltman
Company: Intel Corporation
Date Published: 9/22/2002   Conference: SMTA International


Abstract: With applications of heavy heatsink and smaller pitch BGAs on motherboard for personal computer systems, solder joint integrity under shock load becomes more significant. This work developed a low-cost in-situ strain measurement system for motherboard level and system level shock test.

The designed test can capture the shock oscillation effect at solder joints. The test results indicated that solder joint failure modes are related to the high stress/strain rate and fatigue effects. Finite element analysis is performed at board/system level to correlate to the test results.

Key words: BGA, reliability, solder joint.



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