MONITORING MOTHERBOARD SHOCK STRAIN RESPONSE NEAR BGA SOLDER JOINTSAuthors: Phil Geng and Willem M Beltman
Company: Intel Corporation
Date Published: 9/22/2002 Conference: SMTA International
The designed test can capture the shock oscillation effect at solder joints. The test results indicated that solder joint failure modes are related to the high stress/strain rate and fatigue effects. Finite element analysis is performed at board/system level to correlate to the test results.
Key words: BGA, reliability, solder joint.
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