SMTA International Conference Proceedings


Author: Robert T. Croswell et al.
Company: Motorola Labs
Date Published: 9/22/2002   Conference: SMTA International

Abstract: Embedded Passive (EP) technologies introduce new materials and processes into Printed Wiring Board (PWB) fabrication with the goal of reducing component part count through the removal of surface mount components. This is accomplished by embedding equivalently functional resistors, capacitors and inductors within the inner-layers of the PWB in place of traditionally surface-mounted passive components. Since the internalized, embedded devices require no solder joints, the principal reliability failure mode of PWBs, solder joint failure, is reduced.

Additionally, significant savings are realized through decreased direct material and conversion costs as well as increased factory velocity. Furthermore, in some module constructions, enough surface components can be removed as to free sufficient space for conventional pick & place of the module onto a motherboard, alleviating the need for an overmolding or a Kapton dot (if a metal shield is not electrically required), which would normally provide a smooth surface for the vacuum pick-up nozzle in conventional placement tools.

Key words: embedded passives, mezzanine capacitors, ceramic-filled photodielectric, PTF resistors.

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