SIMPLIFYING PWB ASSEMBLY BY UTILIZING EMBEDDED PASSIVESAuthor: Robert T. Croswell et al.
Company: Motorola Labs
Date Published: 9/22/2002 Conference: SMTA International
Additionally, significant savings are realized through decreased direct material and conversion costs as well as increased factory velocity. Furthermore, in some module constructions, enough surface components can be removed as to free sufficient space for conventional pick & place of the module onto a motherboard, alleviating the need for an overmolding or a Kapton dot (if a metal shield is not electrically required), which would normally provide a smooth surface for the vacuum pick-up nozzle in conventional placement tools.
Key words: embedded passives, mezzanine capacitors, ceramic-filled photodielectric, PTF resistors.
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