RELIABILITY OF NEXT GENERATION COMPONENTS AND SUBSTRATES FOR UNDER-THE-HOOD AUTOMOTIVE ELECTRONICSAuthor: John L. Evans et al.
Company: Auburn University
Date Published: 9/22/2002 Conference: SMTA International
Included in this evaluation is the thermal shock and thermal cycle reliability data for new integrated circuit packages, such as, quad flat no lead (QFNs) packages and small ball grid arrays (BGA) packages. This analysis also investigates the component reliability of "odd shaped" components, like transformers and large capacitors. This analysis includes thermal cycle, thermal shock, and vibration data for various devices.
In addition to the changes in component packaging, new demands are being placed on the substrate technology integrating these devices. For example, many applications are investigating the need for metal backed modules to help sink component level temperatures while providing some level of structural support (i.e. module housing cover).
This paper discusses the results of thermal shock data using laminate materials attached to a variety of metals. Because the thermal expansion of these alternate substrates depends significantly on the attachment material and process, many different attachment materials are discussed.
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