EVALUATING THE EFFECTS OF REFLOW PROFILE CONTROL ON SOLDER JOINT QUALITY AND RELIABILITYAuthors: John L. Evans and Greg Jones
Company: Auburn University
Date Published: 9/22/2002 Conference: SMTA International
These activities can prove vital in helping a company achieve low parts per million (ppm) manufacturing processes. However, while process yields are critical for high volume manufacturing, they are not the only measurement of quality manufacturing. For many electronics products, the quality of the component solder joint may prove just as valuable as the process yield to the manufacturer.
This paper investigates the impact of the reflow profile on the quality of the surface mount solder joint. In particular, the impact of the reflow profile on solder joint voiding is analyzed over a variety of surface mount packages. In addition, this paper discusses the potential impact of alterations to the reflow profile in terms of changes in solder joint characteristics and solder joint reliability.
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