SMTA International Conference Proceedings


EVALUATING THE EFFECTS OF REFLOW PROFILE CONTROL ON SOLDER JOINT QUALITY AND RELIABILITY

Authors: John L. Evans and Greg Jones
Company: Auburn University
Date Published: 9/22/2002   Conference: SMTA International


Abstract: The electronics industry has long viewed process control as an essential tool for achieving high assembly yields. Currently, process control is often applied to solder paste printing, component placement, and reflow soldering phases of the SMT assembly process.

These activities can prove vital in helping a company achieve low parts per million (ppm) manufacturing processes. However, while process yields are critical for high volume manufacturing, they are not the only measurement of quality manufacturing. For many electronics products, the quality of the component solder joint may prove just as valuable as the process yield to the manufacturer.

This paper investigates the impact of the reflow profile on the quality of the surface mount solder joint. In particular, the impact of the reflow profile on solder joint voiding is analyzed over a variety of surface mount packages. In addition, this paper discusses the potential impact of alterations to the reflow profile in terms of changes in solder joint characteristics and solder joint reliability.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819