SMTA International Conference Proceedings


Author: Fritz Byle
Company: Northrop Grumman Kester
Date Published: 9/22/2002   Conference: SMTA International

Abstract: The advent of high-speed solder paste volume measurement systems has led to the capability of rapidly generating more data than it is possible to conveniently analyze. This paper presents a simple yet powerful methodology for assessing the performance of the paste printing process, as well as assessing the repeatability of 3-D paste measurement instruments.

The technique discussed in this paper takes advantage of the power of graphical data representations to enable rapid assessment of process performance. The technique can be applied to data from virtually any 3-D paste measurement system using off-the shelf software, and could be incorporated into such systems easily.

Key words: solder paste, printing, measurement, analysis.

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