SOLDER PASTE PRINTING DATA ANALYSIS: A VISUAL APPROACHAuthor: Fritz Byle
Company: Northrop Grumman Kester
Date Published: 9/22/2002 Conference: SMTA International
The technique discussed in this paper takes advantage of the power of graphical data representations to enable rapid assessment of process performance. The technique can be applied to data from virtually any 3-D paste measurement system using off-the shelf software, and could be incorporated into such systems easily.
Key words: solder paste, printing, measurement, analysis.
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