SMTA International Conference Proceedings


A NOVEL FLIP CHIP APPROACH FOR MICROWAVE/HIGH SPEED DATA CHIP PACKAGING

Authors: Tong Chen and Suchet Chai
Company: Teledyne Technologies
Date Published: 9/22/2002   Conference: SMTA International


Abstract: Flip-chip assembly has become increasingly popular in the microelectronic industry because of its advantage in manufacture and the high product quality that derives from such a process. Particularly, it offers a unique advantage over the traditional wire bonds in microwave and highspeed signal applications due to its shorter and repeatable connections.

However, most of the currently available packages are not suitable for high frequency signal performance with the existing flip-chip technique because of problems with mismatch and signal reflection. This paper proposes packaging structures and assembly approach that take advantage of the flip-chip process to provide good performance for high frequency signals.

Key words: flip-chip, RF, microwave.



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