A NOVEL FLIP CHIP APPROACH FOR MICROWAVE/HIGH SPEED DATA CHIP PACKAGINGAuthors: Tong Chen and Suchet Chai
Company: Teledyne Technologies
Date Published: 9/22/2002 Conference: SMTA International
However, most of the currently available packages are not suitable for high frequency signal performance with the existing flip-chip technique because of problems with mismatch and signal reflection. This paper proposes packaging structures and assembly approach that take advantage of the flip-chip process to provide good performance for high frequency signals.
Key words: flip-chip, RF, microwave.
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