SMTA International Conference Proceedings


INVESTIGATION OF THE MECHANICAL PROPERTIES OF Pb-FREE SOLDER JOINTS BY NANOINDENTATION

Authors: R.R. Chromik, R.P. Vinci, S.L. Allen & M.R. Notis
Company: Lehigh University
Date Published: 9/22/2002   Conference: SMTA International


Abstract: Successful implementation of new Pb-free solder alloys in the electronics industry will require an understanding of the effect of microstructure on the overall strength of a soldered joint. This problem can be approached with finite element modeling if representative microstructures are cataloged and accurate mechanical properties are known for the relevant phases.

Our study has focused on measurement of the mechanical properties of Cu/Sn-Ag-Cu solder joints. Nanoindentation was used to measure the reduced modulus and hardness of the solder matrix and intermetallic phases. Our results provide a mechanical properties dataset for use in future finite element modeling studies of the failure mechanisms of these solder joints under various loading conditions.

Key words: Pb-free solder, mechanical properties, intermetallic, nanoindentation.



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