INVESTIGATION OF THE MECHANICAL PROPERTIES OF Pb-FREE SOLDER JOINTS BY NANOINDENTATIONAuthors: R.R. Chromik, R.P. Vinci, S.L. Allen & M.R. Notis
Company: Lehigh University
Date Published: 9/22/2002 Conference: SMTA International
Our study has focused on measurement of the mechanical properties of Cu/Sn-Ag-Cu solder joints. Nanoindentation was used to measure the reduced modulus and hardness of the solder matrix and intermetallic phases. Our results provide a mechanical properties dataset for use in future finite element modeling studies of the failure mechanisms of these solder joints under various loading conditions.
Key words: Pb-free solder, mechanical properties, intermetallic, nanoindentation.
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