Pan Pacific Symposium Conference Proceedings


Authors: A. Brandolini
Company: Politecnico di Milano
Date Published: 2/2/1999   Conference: Pan Pacific Symposium

Abstract: New generations of microelectronics sensors requires dedicated strategies to optimize the assembling process in order to reach a compromise between performance and costs. The single-block solution does not provide a approachable way to middle-large volume productions and the more the complexity of the sensor increases, the more a modular structure can define the only adaptable design. Previous studies gave enough results to these techniques adopted to simplify the sensor realization by splitting complex structures into different simpler blocks able to perform more elementary functions and allowing the reciprocal interconnection for more complex processing. All these aspects are now formalized in a systematic way that presents a rigorous approach to the design and development of sensors based on different physical properties but unified by a common signal processing arrangement that allows the most advanced features from the detection and measurement point of view.

Keywords:Sensors, Packaging, Multichip Modules.

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