SMTA International Conference Proceedings


WAFER-LEVEL REDISTRIBUTION USING FULLY-ADDITIVE CU/NI/AU METALLIZATION

Author: Lars Boettcher et al.
Company: Fraunhofer IZM Berlin
Date Published: 9/22/2002   Conference: SMTA International


Abstract: The further development, problems and results of a new wafer level redistribution are presented. This process has been stabilized and qualified. Different problems, like the adhesion of the chosen epoxy dielectric and the compatibility of the chemical bathes and the aluminum metallization has been investigated and solved. Also process modification in order to reduce the needed number of process steps has been realized.



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