MODULAR, DEVICE-SCALE, DIRECT-CHIP-ATTACH PACKAGING FOR MICROSYSTEMSAuthors: Daniel F. Baldwin, Ph.D.
Company: Siemens Dematic EAS
Date Published: 9/22/2002 Conference: SMTA International
The design integrated advances in the fields of MEMS fabrication and microelectronics packaging. A through-wafer electrical interconnect structure was developed in order to permit "face-up" device orientations and to minimize the package footprint. An interchangeable polymer assembly system and configurable cap structure allowed the package components to be combined in a modular fashion.
Such flexibility should permit this one package architecture to serve the needs of a variety of MEMS applications. All processing and assembly was conducted at the wafer level after which a standard dicing process singulated individual packages. Conducting unit operations at the wafer level simplified much of the packaging process flow by alleviating alignment, bonding and handling concerns.
The resulting packages were fully compatible with high throughput surface mount equipment.
Key words: MEMS, packaging, electrical interconnect, polymer bonding, wafer level packaging.
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