SMTA International Conference Proceedings


Authors: J.K. "Kirk" Bonner, L. del Castillo, A. Mehta
Company: Jet Propulsion Laboratory
Date Published: 9/22/2002   Conference: SMTA International

Abstract: The use of lead in electronics has come under increasing scrutiny. Given the trends in both Japan and Europe, it is highly likely that the U.S. will be driven by commercial interests to phase out of lead in electronics usage.

This paper presents data collected on a recent NASA project to focus on finding suitable alternatives to eutectic tin-lead solders and solder pastes.

The first phase of this project dealt with determining the most feasible candidates to replace tin-lead and to determine suitable processing operations in assembling printed wiring boards.

Key words: Chlorofluorocarbon (CFC), printed wiring assembly (PWA), printed wiring board (PWB), eutectic tin-lead (Sn 63/Pb 37), lead-free process (LFP), surface mount technology (SMT), solder paste, rosin mildly activated (RMA).

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