HI-REL LEAD-FREE PRINTED WIRING ASSEMBLIESAuthors: J.K. "Kirk" Bonner, L. del Castillo, A. Mehta
Company: Jet Propulsion Laboratory
Date Published: 9/22/2002 Conference: SMTA International
This paper presents data collected on a recent NASA project to focus on finding suitable alternatives to eutectic tin-lead solders and solder pastes.
The first phase of this project dealt with determining the most feasible candidates to replace tin-lead and to determine suitable processing operations in assembling printed wiring boards.
Key words: Chlorofluorocarbon (CFC), printed wiring assembly (PWA), printed wiring board (PWB), eutectic tin-lead (Sn 63/Pb 37), lead-free process (LFP), surface mount technology (SMT), solder paste, rosin mildly activated (RMA).
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.