SMTA International Conference Proceedings


Author: David Bernard
Company: Dage Precision Industries Inc.
Date Published: 9/22/2002   Conference: SMTA International

Abstract: The x-ray inspection of PCB assembly processes is becoming ever more important to undertake as the benefits of using area array packages / chip scale packages / flip chips are applied to more and more products. This is because automated optical inspection (AOI) cannot be used on these devices as their solder contacts are hidden from view.

Achieving the best x-ray inspection for a particular application depends on the selecting the appropriate x-ray inspection system. Whichever system is considered, from whatever manufacturer, at the heart of them all is the x-ray tube. The limitations of traditional closed x-ray tubes, in terms of achievable resolution and magnification, encourages the use of single-staged or double-staged, open (or demountable) x-ray tubes for today’s x-ray analysis, particularly as component and board sizes continue to shrink.

This paper will:

  • Review the basics of x-ray tube type and operation.
  • Discuss the relative advantages and disadvantages of the various tube types including cost of ownership implications.
  • Suggest which tube type is most appropriate for current and future applications.
  • Key words: X-ray, inspection, BGA, CSP, resolution.

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