Telecom Hardware Solutions Conference Proceedings


LIFE PREDICTION OF LEAD FREE SOLDER JOINTS FOR HANDHELD PRODUCTS

Authors: D. Xie, et al.
Company: Flextronics
Date Published: 5/15/2002   Conference: Telecom Hardware Solutions


Abstract: Life prediction of lead free solder joints using the finite element method (FEM) as well as reliability testing was performed. It is learnt from this work that the fatigue life ratio of lead free solder over tin-lead solder is dependent to the testing conditions as well as package types. The validation of life prediction for lead free solder depends not only on the temperature range but also on the component and assembly. The stress level sustained in the solder joints play a key role.

It is indicated that there exists a threshold of stress level: the fatigue life of the lead free solder is higher than that of tin-lead if the stress is below the threshold. However, for most telecommunication applications, the fatigue life of the Sn-Ag-Cu series alloy shall be higher than that of Sn63Pb37. To verify the prediction models, temperature cycling tests including both thermal cycling (TC) and thermal shock (TS) are employed and the results show the prediction by FEM is acceptable.



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