LIFE PREDICTION OF LEAD FREE SOLDER JOINTS FOR HANDHELD PRODUCTSAuthors: D. Xie, et al.
Date Published: 5/15/2002 Conference: Telecom Hardware Solutions
It is indicated that there exists a threshold of stress level: the fatigue life of the lead free solder is higher than that of tin-lead if the stress is below the threshold. However, for most telecommunication applications, the fatigue life of the Sn-Ag-Cu series alloy shall be higher than that of Sn63Pb37. To verify the prediction models, temperature cycling tests including both thermal cycling (TC) and thermal shock (TS) are employed and the results show the prediction by FEM is acceptable.
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