IMPLICATIONS OF FINE BALL GRID ARRAY DIMENSIONAL VARIATIONAuthor: Syed Sajid Ahmad
Company: Micron Technology
Date Published: 9/12/1999 Conference: SMTA International
Size variations exceeded supplier specifications in some cases. Higher variations may require unnecessary and costly changes in processing procedures and equipment.
This study brings the importance of dimensional control to the attention of fine BGA and materials (solder balls, substrates, films, etc.) suppliers, related equipment manufacturers, processors and customers.
Key words: BGA, solder balls, dimensional control, voids, standards.
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