SMTA International Conference Proceedings


IMPLICATIONS OF FINE BALL GRID ARRAY DIMENSIONAL VARIATION

Author: Syed Sajid Ahmad
Company: Micron Technology
Date Published: 9/12/1999   Conference: SMTA International


Abstract: Sample data gathered on the variation in FBGA (Fine Pitch Ball Grid Array, ball grid array with array pitches less than 1 mm) packages and their solder ball dimensions are presented. These data were gathered on FBGAs obtained from various sources. Effects of these variations on FBGA processing are discussed. Needs to reduce these variations are examined.

Size variations exceeded supplier specifications in some cases. Higher variations may require unnecessary and costly changes in processing procedures and equipment.

This study brings the importance of dimensional control to the attention of fine BGA and materials (solder balls, substrates, films, etc.) suppliers, related equipment manufacturers, processors and customers.

Key words: BGA, solder balls, dimensional control, voids, standards.



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