Journal of SMT Article
ELECTROCHEMICAL MIGRATION ON HASL PLATED FR-4 PRINTED CIRCUIT BOARDS
Company: Naval Surface Warfare Center
Date Published: 4/1/2004 Volume: 17-2
This paper investigates the effects of chloride contamination and electric field on the migration behavior of hot air solder level (HASL) plated FR-4 printed circuit boards. It was found that chloride contamination level and electric field influence which failure mechanism is occurring, electrochemical migration or electrolytic corrosion. This study concludes that current industry specifications for cleanliness may be inadequate for the next generation of electronic assemblies.
Key words: electrochemical migration, dendritic growth, electric field, contamination.
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