Journal of SMT Article
REAL TIME VISUALIZATION AND PREDICTION OF SOLDER PASTE FLOW IN THE CIRCUIT BOARD PRINT OPERATION
Company: Cookson Electronics
Date Published: 1/1/2003 Volume: 16-1
Third, a model describing the release mechanism including sheer and adhesion forces is developed and compared to experimental results. Additionally, a real-time visualization technique and a model for solder paste flow into stencil apertures during the squeegee operation are described and results discussed.
Key words: surface mount, fine feature, transfer efficiencies, solder paste, stencil printing.
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