Journal of SMT Article
ELECTRICAL CHARACTERIZATION OF LEAD-FREE SOLDER SEPARABLE CONTACT INTERFACES
Company: University of Maryland - CALCE
Date Published: 4/1/2002 Volume: 15-2
In this study, the contact resistance versus contact force characteristics of tin-silver-copper (SnAgCu) and tin-lead (SnPb) solder separable contact interfaces were measured and compared. An automatic contact resistance probe developed at the CALCE center was used to measure the contact resistance. The effect on contact resistance of different aging conditions, including mixed flowing gas, steam, and dry heat aging was examined. Energy dispersive spectroscopy (EDS) surface analysis was performed on selected samples to determine the nature of the surface films. Overall, the tin-silver-copper lead-free solders tested in this study have similar contact resistance behavior when compared with tin-lead eutectic solder for all aging conditions. The MFG aging test and EDS analysis results show that the tin-silver-copper lead-free solder coating is not sensitive to corrosive gases like chlorine and hydrogen sulfide.
Key words: Lead-free solder, contact resistance, aging.
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