Journal of SMT Article
STACKED MULTI-CHIP PACKAGING FOR THE NEXT GENERATION ELECTRONICS
Company: Tessera Technologies
Date Published: 4/1/2002 Volume: 15-2
The following paper will introduce several alternative multiple-die package solutions utilizing flexible substrates, along with some new and very unique (but widely available) assembly processes and methodologies.
Key words: BGA, mBGA®, chip scale packaging, CSP, ball grid array, fine pitch ball grid array, FBGA, system-in-package, SiP, stacked die.
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