Journal of SMT Article
LAND GRID ARRAY PACKAGING TECHNOLOGY IN PORTABLE ELECTRONICS
Company: Nokia Mobile Phones
Date Published: 4/1/2002 Volume: 15-2
In this study, LGA packaging technology is discussed from the volume production point of view. Moreover, many aspects relating to LGA processing are presented and some of the design parameters critical for volume production are described. The reliability of various LGA packages, with both flip chip (FC) and wire bond (WB) first level interconnections, is evaluated using thermal cycling and board level drop tests designed for a portable use environment. Several quality factors in LGA packages and in second level solder joints are brought out. Furthermore, failure modes related to quality and fatigue life performance are described and discussed.
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