Journal of SMT Article


Authors: Yun Zhang, et al.
Company: Lucent Technologies
Date Published: 10/1/2000   Volume: 13-4

Abstract: The electronic industry is under extreme pressure to remove lead containing solders from electronic components. Pure tin is one of the alternatives and may be the simplest system as a “drop-in” replacement. However, fear of “whiskers” has been a major concern inhibiting its implementation.

This paper analyzes the current understanding of the whisker phenomena, and describes a systematic whisker test that could find wide applicability in the electronics industry. Correlation is found between whisker growth and coating properties such as carbon content and grain size.

Key words: whisker, whisker test, electroplated tin.

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