Journal of SMT Article
Via-In-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware
Company: IBM Corporation
Date Published: 7/1/2017 Volume: 30-3
In order to accommodate these next generation requirements, Enterprise Class printed circuit board assemblies (PCBAs) are now being designed using a variety of advanced via structures – including via in pad plated over (VIPPO) technology. Integration of VIPPO vias helps provide a solution to a variety of challenges including: increased system functionality, increased component placement densities, signal routing/fan-out constraints, and thermal/power distribution management.
This paper discusses a variety of elements concerning VIPPO technology including high quality PCB manufacturing construction, VIPPO usage applications, decision making pros and cons of the technology, key PCBA design parameters of interest, and new findings regarding VIPPO interconnect reliability performance and sensitivity to PCB attributes. The intent of the paper is to discuss key considerations, design elements, and assembly reliability performance observed to date when using VIPPO structures on Enterprise Class Server and Storage hardware.
Key words: design for excellence, via in pad plated over (VIPPO), via reliability, interconnect reliability
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