Journal of SMT Article

Via-In-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware

Authors: Matt Kelly, Mark Jeanson, Timothy Younger, Jim Bielick, Theron Lewis, Mitch Ferrill
Company: IBM Corporation
Date Published: 7/1/2017   Volume: 30-3

Abstract: Component placement densities of electronic packages on PCBs continues to increase. Advanced component functionality is driving more I/O signal channels and more power/ground distribution layers. Power regulators and FETs are operating at higher power levels and must deal with increased heat duties; thermal management of these devices is critical for reliable operation. From a system perspective, product form factors (rack sizes) continue to be standardized and are not getting any larger.

In order to accommodate these next generation requirements, Enterprise Class printed circuit board assemblies (PCBAs) are now being designed using a variety of advanced via structures – including via in pad plated over (VIPPO) technology. Integration of VIPPO vias helps provide a solution to a variety of challenges including: increased system functionality, increased component placement densities, signal routing/fan-out constraints, and thermal/power distribution management.

This paper discusses a variety of elements concerning VIPPO technology including high quality PCB manufacturing construction, VIPPO usage applications, decision making pros and cons of the technology, key PCBA design parameters of interest, and new findings regarding VIPPO interconnect reliability performance and sensitivity to PCB attributes. The intent of the paper is to discuss key considerations, design elements, and assembly reliability performance observed to date when using VIPPO structures on Enterprise Class Server and Storage hardware.

Keywords: 

Key words: design for excellence, via in pad plated over (VIPPO), via reliability, interconnect reliability



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