Journal of SMT Article
Isothermal Fatigue of High Temperature Solder Joints
Company: Universal Instruments Corporation and Annapolis Micro Systems
Date Published: 4/1/2017 Volume: 30-2
In this work, a test methodology was developed for high temperature isothermal shear fatigue of individual solder joints. A total of six solder alloys, five Pb-based alloys and one Pb-free alloy were tested at 25°C and 200°C. Joints tested at 200°C were first stored at 200°C for 1000hrs to measure performance in a simulated high temperature environment. The microstructure was studied in conjunction with the fatigue results to understand the structure-property-performance relationship. Result show those alloys with a dendritic structure had a greater characteristic life at room temperature. At 200°C coarsening of the microstructures led to dramatically different results.
Key words: Isothermal Fatigue, High Temperature, Microstructure, Solder Alloys
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