Journal of SMT Article
A Nanocopper Based Alternative to High Temperature Solder
Company: Binghamton University, Lockheed Martin, and Auburn University
Date Published: 4/1/2017 Volume: 30-2
Assessment of the reliability of existing joints, not to mention the optimization and prediction of the reliability of new versions of the material, will require much more than just accelerated testing. Different versions of the nano-Cu material are being characterized in terms of creep rates and mechanisms as well as the behavior in both thermal and isothermal cycling. Microstructures are characterized by FIB polishing, to preserve porosity structures, followed by optical microscopy, SEM, and TEM. Generalization of results requires us to distinguish between competing effects of the distributions of grain sizes and pores on creep. Experiments were extended to include nano-porous Au samples with much larger grain sizes to help resolve that.
We conclude that counteracting effects of grain sizes and pore distributions on ductility, strength and fatigue resistance may offer opportunities for optimization of nano-particle based joint structures. So far we argue that comparisons of the present nano-Cu material to solder in accelerated thermal or isothermal cycling will tend to be extremely conservative.
Key words: Nano-particles, high temperature, reliability
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