Journal of SMT Article
3D Wafer Level Packaging by Using Cu-Through Silicon Vias for Thin MEMS Accelerometer Packages
Company: Fraunhofer Institute for Electronic Nano Systems and Technische Universität Chemnitz
Date Published: 3/1/2017 Volume: 30-1
According to this, two WLB technologies are investigated: glass frit bonding as well as Silicon Direct Bonding (SDB) of Si-SiO2. The first technique has been demonstrated using a MEMS accelerometer including electrical tests and cross sectional analysis.
3D-WLP, MEMS, Through Silicon Via, Silicon Direct Bonding, Thin Package
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