Journal of SMT Article

Validated Solder Coverage for Tin Whisker Mitigation of 0402 Ceramic Capacitors: An Exercise in Technically Sound Cost Reduction

Author: Bruce M. Misner
Company: Orbital ATK, Defense Electronic Systems Division
Date Published: 9/1/2016   Volume: 29-3

Abstract: Most Department of Defense (DoD) programs demand tin-whisker mitigation to enhance long-term reliability. This typically necessitates tin-lead (Sn/Pb) solder dipping of tin plated components to combine the tin with at least 3% lead. This technique has been proven throughout the industry to mitigate tin-whisker growth [1,2,3]. As a cost saving measure, a project was designed for 0402 capacitors to validate Sn/Pb solder coverage from conventional SMT soldering operations is equivalent to solder dipping. This paper presents the micro-sectioning, extensive X-Ray Florescence (XRF) testing and supporting analysis to demonstrate a cost-effective, 5 sigma process to mitigate tin whiskers can be achieved in lieu of solder dipping.

Keywords: 

Tin Whisker, Validated Solder Coverage, Mitigation, XRF, Micro-section, Variability



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819