Journal of SMT Article
The Effects of Reflow Profile Parameters on Sn-Ag-Cu Solder Bumps and Cu Substrate Using Full Factorial Design
Company: Kwame Nkrumah University of Science and Technology and University of Greenwich
Date Published: 10/1/2014 Volume: 27-4
The results indicate that time to peak temperature is the most significant factor in the reflow soldering process and the optimum reflow profile settings depend on the solder volume. By means of Minitab software, it was found that high time to peak temperature leads to an increase in intermetallic compound (IMC). Furthermore, the findings indicate that the ramp-up rate is a function of preheat temperature and time. While establishing an optimum reflow profile for (Sn-Ag-Cu) alloy using full factorial design technique, time to peak temperature emerged as the significant factor and that the solder volume affects the IMC growth.
In practical terms, a single reflow profile must be obtained by further optimization of the process window obtained in this work. This is due to the fact that a single circuit board will have different volumes of solder.
Soldering, Pb-free solder, reflow optimal setting, solder bumps, Intermetallic compound layer thickness
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