Journal of SMT Article

Reliability Degradation of SAC105 and SAC305 BGA Packages Under Long-Term, High Temperature Aging

Authors: Zhou Hai, Jiawei Zhang, Chaobo Shen, E. K. Snipes, J. C. Suhling, M. J. Bozack and J. L. Evans
Company: Auburn University
Date Published: 4/1/2014   Volume: 27-2

Abstract: The thermal cycling performance of Pb-free (SAC105 and 305) fine-pitch BGA packages degrades up to 61% after 2 years of aging at high temperatures. The test array ranged from 19mm, 0.8mm pitch ball grid arrays (BGAs) to 5mm, 0.4mm pitch µBGAs; 0.65mm MLF and 2512 resistors. The isothermal aging temperatures were 25°C, 55°C, 85°C and 125°C over time periods of 0, 6, 12, and 24 months. The thermal cycling profile was from -40°C to 125°C with 15 min dwell times at the high and low peak temperatures. Weibull tracking and the associated thermal-mechanical (microstructural) response are reported. The dominant failure mode is associated with cracks that run along the growing Cu6Sn5 and Ag3Sn phases that develop during aging and subsequent cycling.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is prohibited. Downloaded papers must only be stored on a local hard drive and not in a shared repository either internal or external.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344

Phone 952.920.7682
Fax 952.926.1819
Home
Site Map
Update Your Info
Related Links
Send Us Feedback
Contact Us
Privacy Policy
↑ Top