Study of Sulfide Films Grown on Printed Circuit Boards
Authors: Anil Kurella, Ph.D. and Balu Pathangey, Ph.D. Company: Intel Corporation Date Published: 10/31/2012
Abstract: Corrosion of electronics is a growing concern with the evolution of new product designs and their usage in complex environments. In this paper the focus is on the Printed Circuit Board (PCB) that is frequently reported for corrosion related problems. Sulfide films were grown on PCB's with Immersion Silver (ImAg) and Organic Solderability Preservative (OSP) surface finish. Time of Flight Secondary Ion Mass Spectroscopic (TOF SIMS) depth profiling showed significant moisture accumulation in the region below the corrosion product. In both the cases (ImAg and OSP) copper was seen to diffuse through the surface finish and react with the sulfide rich environment.