Journal of SMT Article

Study of Sulfide Films Grown on Printed Circuit Boards

Authors: Anil Kurella, Ph.D. and Balu Pathangey, Ph.D.
Company: Intel Corporation
Date Published: 10/31/2012   Volume: 25-4

Seika Machinery, Inc.

Abstract: Corrosion of electronics is a growing concern with the evolution of new product designs and their usage in complex environments. In this paper the focus is on the Printed Circuit Board (PCB) that is frequently reported for corrosion related problems. Sulfide films were grown on PCB's with Immersion Silver (ImAg) and Organic Solderability Preservative (OSP) surface finish. Time of Flight Secondary Ion Mass Spectroscopic (TOF SIMS) depth profiling showed significant moisture accumulation in the region below the corrosion product. In both the cases (ImAg and OSP) copper was seen to diffuse through the surface finish and react with the sulfide rich environment.

Keywords: 

corrosion, copper sulfide, PCB



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