Journal of SMT Article

Analysis of Corrosion Films in Printed Circuit Board Assemblies

Authors: Anil Kurella Ph.D., Balu Pathangey Ph.D., Zhiyong Wang Ph.D., and Tim Ciarkowski
Company: Intel Corporation
Date Published: 1/30/2012   Volume: 25-1

Abstract: Corrosion of electronics in harsh environments is an emerging industry problem. This study focused on a detailed morphological and chemical characterization of the corrosion products both from the field as well as those simulated in the lab. The evolution and spread of Cu2S, the key corrosion product, was influenced by the external sulfur based contamination. The chemical depth profiles clearly showed the diffusion of copper through the corrosion products to the surface along with OH build-up along the copper substrate interface. Chlorine when present in the reaction environment drives the migration of products and is the precursor for material movement. The work also validated weight gain change method as a technique to measure corrosion for lab based coupon simulation studies.

Keywords: 

corrosion, PCB, creep, migration, environment, humidity



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