Journal of SMT Article
Pb-free Alloy Silver Content and Thermal Fatigue Reliability of a Large Plastic Ball Grid Array (PBGA) Package
Company: Alcatel-Lucent, Celestica, Inc., LSI Corp., and GE
Date Published: 1/30/2011 Volume: 24-1
The test results show that the thermal fatigue performance improved substantially with a higher Ag content BGA alloy. Surprisingly, assembly with the higher Ag solder paste resulted in a measureable though small increase in thermal fatigue performance of both the SAC305 ands SAC105. The characteristic fatigue lifetime was inversely proportional to the test dwell time, which is consistent with previously published findings on this BGA package as well as SAC solders in general.
Pb-free solder, Ag content, thermal fatigue, accelerated temperature cycling, dwell time.
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